characteristic
· 3.5mm × 3.5mm
· Highly reliable technology without gold wire package
· Ceramic substrate
· High luminous flux, high luminous efficiency
· Reflow solderable
· RoHS certified
introduce
Based on platform of flip chip bonding without bonding wires technology, E-Star products have the advantages of high-reliability, low-thermal-resistance characteristics. It exhibits better luminous efficiency, superior color uniformity and provides excellent illumination quality for indoor and outdoor lighting uses.
Application
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| Street Light |
| PAR Light
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| High Light
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| Auto Light
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Technical Advantage（Flip-Chip Bonding, free from bond wires）
| Model | CRI | CCT (K) | Luminous Flux typ. (lm) | Luminous efficacy typ. (lm/W) | Foward Current (mA) | Forward Voltage (V) |
| ESG3 | 70 | 5700 | 165 | 158 | 350 | 2.95 |
| ESD3 | 70 | 5700 | 130 | 120 | 350 | 3.00 |
| ESG3 | 70 | 4000 | 155 | 136 | 350 | 2.95 |
| ESG3 | 70 | 3000 | 150 | 132 | 350 | 2.95
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